Process Engineer

Catapult
Newport
1 week ago
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Reporting to the Engineering Manager, the Packaging Process Engineer will work in a challenging R&D environment to explore and develop disruptive packaging and integration technologies to make next-generation systems more energy and packaging efficient.

The Process Engineer will work with a team of multidisciplinary engineers to develop novel semiconductor chip assembly and integration processes for advanced packaging of compound semiconductor-based devices, modules and systems.

They will apply their knowledge to solve the assembly and bonding challenges in the advanced packaging of compound semiconductor products using a wide range of die and wire bonding materials. Key responsibilities include:

  • Participate in the Semiconductor packaging, assembly process development, prototyping, and bill of materials (BOM) strategies for single die, multi-die or system in package (SIP) packaging solutions for power electronics/ RF/ Photonics
  • Provide package design inputs, material selection and assembly process development for a number of different semiconductor packages
  • Follow the semiconductor/ micro-electronic package process flow, material set, test vehicle, DOEs, process control plans to successfully develop manufacturable and reliable packaging processes such as Die attach technologies, Flip-Chip, hybrid bonding, Wire bond, SIP (System in Package)
  • R&D of assembly interconnects and interfaces
  • Semiconductor package prototyping, testing, reliability & failure analysis
  • Develop semiconductor assembly process of interpreting reports derived from design of experiments (DOEs) and ensure all potential obstacles are identified and provide mitigation plans for identified issues
  • Work with internal design and products teams and drive design for manufacturing (DFM) methodology for new technologies
  • Actively research to resolve semiconductor assembly interconnect challenges through developing new integration schemes and characterisation of novel packaging architectures involving highly technical and scientific methods
  • Study microelectronics assembly process, bonding materials and apply the knowledge to develop advanced interconnects for compound semiconductor device and module packaging
  • Gather customer requirements and follow procedures to build assembly process relevant to the project work.
  • Conduct experiments to determine material properties and relate these to project work
  • Use results from simulations and experiments to aid package design
  • Operate key assembly equipment and undertake process and SOP development
  • Generate technical reports on results and conclusions drawn from experiments conducted and incorporate findings in formal specifications
  • Estimate set-up times, flow-times, costs of production and acceptance equipment
  • As needed, performs support functions for project planning to achieve quality, delivery schedules, and cost objectives
  • Work closely with suppliers providing technical specifications and procuring components and test equipment to specification and budget
  • Participate in technical risk assessments


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