Senior Packaging Engineer

Platform Recruitment
King's Cross, London, WC1H 8AL, United Kingdom
2 days ago
£130,000 – £150,000 pa

Salary

£130,000 – £150,000 pa

Job Type
Permanent
Work Pattern
Full-time
Work Location
Hybrid
Seniority
Senior
Education
Degree
Visa Sponsorship
Available
Posted
13 Jul 2026 (2 days ago)

Benefits

25 days holiday Pension scheme Private healthcare Remote working allowance Professional development budget

Senior / Staff Packaging Engineer

London (Hybrid)

My client is an innovative AI hardware startup developing next-generation computing technology designed to revolutionise AI infrastructure. They're looking for an experienced Packaging Engineer to help bridge the gap between cutting-edge silicon and high-performance products, working on advanced semiconductor technologies alongside a world-class engineering team.

Role Requirements:

*

Lead the development of advanced semiconductor packaging solutions from concept through to production

*

Design and optimise package, substrate and system-level integration for high-performance devices

*

Work across package architecture, layout, simulation and product development activities

*

Collaborate with ASIC, hardware and systems engineers to deliver innovative packaging solutions

Key Skills Required:

*

Experience in semiconductor packaging or advanced electronic packaging

*

Knowledge of package, substrate or PCB design and integration

*

Experience using industry-standard package or PCB design tools

*

Understanding of signal integrity, power integrity or high-speed design principles

*

Experience working with multidisciplinary engineering teams throughout product development

If this sounds like you, please apply

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