Semiconductor Recruitment Trends 2025 (UK): What Job Seekers Need To Know About Today’s Hiring Process
Summary: UK semiconductor hiring has shifted from credentials & tool lists to capability‑driven evaluation that emphasises shipped silicon, yield/reliability gains, verification coverage, DFM/DFT maturity, robust bring‑up, safe/efficient fab operations and measurable business impact (PPM, YMS wins, time‑to‑yield, test cost, opex). This guide explains what’s changed, what to expect in interviews and how to prepare—especially for RTL/ASIC/SoC, analog/mixed‑signal/RF, verification, physical design, DFT/ATPG, product/test, failure analysis & reliability, process/device, equipment/maintenance, EHS, supply chain & operations roles. Who this is for: Digital design & verification engineers, PD & timing closure, analog/mixed‑signal/RF designers, DFT/ATPG/BIST, STA/PDN/SI/PI specialists, product/test engineers (ATE/DFT), yield/reliability & FA, device/process (FEOL/BEOL), equipment & facilities, EHS/compliance, supply‑chain/outsourcing (OSAT/Foundry), and programme/product managers across the UK semicon ecosystem.
