Semiconductor Jobs

Enterprise Recruitment · Towcester · £60,000 – £65,000 pa

This role involves hands-on engineering support for production operations, maintaining and improving epitaxy equipment, and driving continuous improvement initiatives. You will coordinate maintenance, support equipment upgrades, and collaborate with cross-functional teams to ensure high equipment uptime and compliance with safety standards.

Lumai · Oxford

Owns dense, high-layer-count PCB layout from schematic handoff to fabrication release, covering stackups, HDI structures, controlled-impedance routing, differential pairs and BGA breakout for large FPGAs and custom ASICs. Acts as the main technical contact with fabricators and assembly houses, and sets the footprint libraries, design rules and CAD standards the wider team works to.

Renesas Electronics · Edinburgh

Design and verify CMOS analog blocks such as amplifiers, oscillators, LDOs, comparators and reference/biasing circuits for custom ASICs, balancing performance, area, power and timescale. The role carries technical leadership of sub-systems from specification through to production ramp, guiding layout, DFT and test engineers, driving silicon debug and lab evaluation, and mentoring less experienced team members.

Endeavour Recruitment · Bedford · £43,500 – £54,500 pa

Design and develop mixed electrical/electronic solutions from concept to completion, including analogue, digital, microprocessor, FPGA and power electronics for harsh environments. Based on-site at Ampthill, reporting to the Design Team Lead, the role covers circuit simulation, EMC awareness, testing and technical documentation within a phase-gate process.

Winsearch · Manchester · £50,000 – £57,000 pa

Designs analogue and digital circuits, schematics and PCB layouts for advanced scientific instrumentation, working alongside physicists, software and mechanical engineers. Owns designs from specification through prototyping, testing and volume manufacture, with FPGA work and high-speed digital design. Based in a collaborative R&D team supporting products across their full lifecycle.

University of Southampton · Southampton · £46,049 – £58,225 pa

Designs PHY-level and die-to-die interfaces, custom pad circuits, drivers, receivers, ESD structures, termination and clocking for heterogeneous integration demonstrators. Handles floorplanning, I/O ring planning and interface layout across dies, interposers and packaging substrates, and acts as Technical Authority for analog/mixed-signal interfaces while supporting industry partners and workshops.

Lumai · Oxford

Owns signal and power integrity across high-speed boards and packages, running pre-layout channel studies, post-layout SI analysis with IBIS-AMI models, and PDN impedance and DC drop work for high-current ASIC and FPGA rails. Channels span chip, package, interposer, board and optical engine, with heavy bench correlation using VNAs, TDRs and oscilloscopes to feed design rules.

Renesas Electronics · Cambridge

Designs, builds and maintains a federated platform API, gateway service, SDKs, MCP servers and API clients, working across C#, Python and Golang. The role also covers an applications framework, BI analytics reporting and a new developer centre, with heavy cross-team collaboration and direct customer adoption support.

Amazon · Cambridge

Architect and implement SoC designs for Blink/Ring smart home cameras and doorbells, owning the flow from RTL delivery through synthesis, power analysis and timing closure. The role also involves defining microarchitecture specs, mentoring junior engineers, and evaluating emerging IP blocks in a vertically integrated environment spanning architectural modelling to post-silicon validation.

Broadcom · United Kingdom-Remote Location

Delivers technical consulting on IBM Mainframe AIOps and automation, covering WLM, System Automation, Omegamon, CA-Sysview, CA OPS/MVS and Netmaster. Works with sales teams on qualification, complex demos, proofs of concept and solution architecture, acting as a subject matter expert for customers and partners. Requires deep mainframe experience, European language skills and around 50% travel.

Cambridge GaN Devices · Cambridge

Senior leadership role owning the packaging function for GaN power semiconductors, combining people leadership with hands-on design of wirebond, flip chip and embedded packages. Involves multiphysics simulation, supplier development, qualification testing and roadmap input, working with internal teams and overseas partners from the Cambridge office.