Director of Packaging

Director of Packaging

Team – Research and Development

Location – Cambridge, UK

Contract – Permanent

About CGD

Making Sustainable Power Electronics Possible

A spin-out of the Cambridge University, Cambridge GaN Devices (CGD) is a fabless semiconductor company that develops a range of energy-efficient GaN-based power devices to make greener electronics possible.

The global power semiconductor market is expected to exceed $50BN. In addition to the multi-million seed fund and Series A and now B private investments, CGD has so far successfully secured four projects funded by iUK, BEIS and EU (Penta). The technical and commercial expertise of the CGD team combined with an extensive track record in the power electronics market has been fundamental in early market traction of our proprietary technology.

Bringing Innovation into Everyday Life

The environmental need for solutions to resolve the world’s most significant challenges (energy consumption and CO2 emissions) inspires us to contribute to society by preserving nature with energy-efficient power solutions.

With a mindset on pushing the limits of semiconductor (GaN) properties and an outstanding team of worldwide experts leveraging knowledge, IP, and decades of research, we demonstrate technological advancement by developing green solutions for everyday electronics, respecting our planet’s natural resources, and creating a more sustainable future for the generations to come.

Why Work for CGD

We Champion Commitment, Celebrate Empowerment, and Reward the Brave.

We are interested in change-makers with a passion for power semiconductors who are willing to explore unconventional ways to meet the company’s green agenda.

At CGD, we pride ourselves on putting empowerment and commitment at the core of our company culture. We offer a relaxed yet productive working environment where everybody is valued and respected and becomes part of commercial success while experiencing professional growth.

If your heart beats for innovation, challenge, and growth, and if the prospect of joining a friendly and game-changing company is for you, we want to hear from you.

The Opportunity

CGD is looking for a Director of Packaging to join our growing engineering team. Reporting directly to the Vice President of Research and Development, this is an exciting opportunity to join CGD at an early stage and help drive the development of innovative packaging solutions for CGD’s GaN power products.

As a senior leader, the Director of Packaging will lead and develop the function, building future capability and creating an environment in which people can perform at their best. They will role-model CGD's values and leadership behaviours, creating clarity, accountability and trust while encouraging challenge, collaboration and innovation. The successful candidate will be expected to shape direction, lead through others and influence the wider organisation, not simply deliver through their own area of expertise.

This is a Grade 7 leadership role with significant responsibility for the direction, performance and development of the function. The role carries a high degree of autonomy and judgement, and the successful candidate will be comfortable making complex decisions, balancing competing priorities and taking accountability for outcomes where there may not be a clear or established path. They will be expected to anticipate future challenges, identify opportunities and influence stakeholders across different functions, disciplines and locations.

The role will be accountable for translating company strategy into clear functional priorities and ensuring that the team has the capability, focus and resources required to deliver. The Director will work collaboratively with the Executive team, contributing their expertise and perspective to wider business decisions and helping to shape the future direction of CGD.

The current packaging team at CGD is expanding and requires an experienced leader to shape the future direction of advanced and innovative packaging technologies for high-speed GaN power semiconductors. Although this is a senior leadership position, it is also very much a hands-on technical role.

The role is based at the company’s office in Cambridge, UK, with some international travel to subcontractors expected.

Main Responsibilities

• Leading the design and technical development of high performance and high-density semiconductor packaging solutions for CGD GaN power products
• Working closely with both internal (e.g. GaN chip design team, Application Engineering team, Operations team) and external (e.g. packaging partners) stakeholders, in the UK and overseas
• Designing wirebond, flip chip and embedded semiconductor packages, including wafer back-end process modifications, to meet the product goals in terms of form factor, cost, quality, electrical and thermal performance
• Support module developments, either internally or with customers
• Supporting semiconductor packaging verification and qualification tests, including driving the package related performance tests such as board level reliability, thermal characterisation etc
• Surveying global suppliers for suitable packaging technologies in support of CGD product and technology roadmaps
• Driving package technology developments with suppliers to differentiate CGD products
• Conducting multiphysics simulations (finite element modelling) to analyse package and system level thermal performance, parasitic extraction, current spreading, electromagnetic fields and thermo-mechanical stress of CGD’s GaN power packages
• Contributing to the development and enhancements of the design process, tools and methodologies to streamline the design flow for right first-time solutions
• Build professional networks to keep up to date with state-of-the-art packaging and process development in both industry and academia
• Conducting first article inspection and failure analysis in the labs in Cambridge as well as with external partners
• Supporting the Applications Engineering team and customers by providing packaging related resources such as package outline drawings, thermal models, PCB footprints, application notes and technical support
• Providing a significant contribution to the CGD product and technology roadmap development