Process Engineer

Process Engineer

Hartlepool

Overview

Wolviston Management Services is supporting our amazing client in the recruitment of a Process Engineer to join their growing team.

Due to continued growth and investment in advanced packaging and assembly capability, they are expanding their Process Engineering function to support the transition of new technologies into stable, high-yield manufacturing.

The Role

This position will focus on the development, optimisation and control of advanced semiconductor module assembly processes, with a particular emphasis on die attach and wire/ribbon bonding technologies.

The successful candidate will play a key role in bridging development and production, ensuring processes are robust, scalable and capable of supporting future technology requirements.

Key Responsibilities Technology & Roadmap Development

Collaborate with Engineering to identify and mature manufacturing technologies aligned to future product requirements

Evaluate emerging assembly and interconnect technologies to support increased power density and frequency performance

Assess manufacturability, scalability and cost implications of new technologies

Lead feasibility trials and proof-of-concept activities

Support supplier evaluation and make/buy decisions Die Attach Process Engineering

Develop and optimise processes including silver epoxy, silver sinter and eutectic attach (AuSn)

Define process parameters (temperature, pressure, time and atmosphere)

Deliver process validation, qualification and reliability testing

Characterise bond performance including voiding, bond line thickness and thermal resistance

Support material selection and supplier development Wire Bonding Development

Establish and optimise gold wire and ribbon bonding processes (ball and wedge)

Define process parameters across varying substrates and metallisation types

Perform mechanical testing (pull/shear) and reliability assessments

Resolve bonding challenges including intermetallic formation and pad integrity

Support fine-pitch and high-frequency assembly requirements Manufacturing & Continuous Improvement

Define, document and control manufacturing processes and workflows

Develop SOPs, control plans and process documentation

Monitor process capability (SPC, Cp/Cpk) and drive yield improvements

Lead root cause investigations using structured methodologies (8D, DMAIC, FMEA)

Deliver continuous improvement initiatives targeting cost, quality and cycle time New Product Introduction (NPI)

Support DFM/DFA activities during product development

Develop pilot builds and process validation strategies

Work cross-functionally to ensure smooth transition into production

Define tooling, fixturing and automation requirements Requirements Essential

Degree in Engineering, Materials Science, Physics or related discipline

Experience in semiconductor or RF module manufacturing environments

Hands-on experience with at least one of the following:

Silver epoxy die attach

Silver sintering

Eutectic die attach

Gold wire bonding

Strong understanding of materials behaviour and thermal management

Experience in process validation and statistical analysis

Proven problem-solving capability within a manufacturing setting Desirable

Background in high-precision electronics, automotive or power electronics manufacturing

Experience in high-tech or semiconductor production environments

Knowledge of RF packaging and JEDEC standards

Experience with equipment specification and commissioning

Familiarity with thermomechanical modelling and reliability testing

Understanding of ISO 9001 or IATF 16949 quality systems Key Attributes

Analytical, structured and detail-oriented approach

Strong cross-functional collaboration skills

Ability to translate technical requirements into practical manufacturing solutions

Hands-on and proactive within a production environment

Comfortable working across both development and operations

Capable of managing priorities in a fast-paced, scaling organisation