Assembly Engineer

Forefront RF
Cambridge, United Kingdom
6 days ago
Job Type
Permanent
Work Location
On-site
Posted
10 Aug 2026 (6 days ago)

Assembly Engineer

Location:Cambridge, UK

Team:New Product Introduction

Job Type: Full-Time, Permanent

About Us:

Forefront RF is a fabless semiconductor company developing breakthrough RF technology that radically simplifies RF front-end architectures for mobile and connected devices. Our long-term vision is to empower anyone to treat global connectivity as a commodity, effortlessly adding it to any device. We lead through innovation, solving our customers’ toughest challenges, enabling them to stay ahead by pushing the boundaries of RF design.

Our Values:

Our values are the quiet nudge that help us to be our best in every interaction.

  • One team: We listen, share, and build solutions together. Collaboration is at the heart of how we work. We support one another, embrace challenges and fun, and celebrate collective success.
  • Innovation with intent: We operate at the forefront of technology, building innovative pathways to the future that meets real customer needs.
  • Solutions driven: We develop world leading manufacturable products that deliver effortless connectivity.
  • Customer focused: We act with integrity, hold ourselves accountable, and are guided by a deep commitment to deliver customer focused solutions.
  • Sustainable: We design for longevity and reuse - leveraging globally connected RF technology to extend product lifecycles and reduce waste.

Role Overview:

We’re looking for an Assembly Engineer to help drive the assembly and packaging activities behind our RF semiconductor products as we continue to scale the business. This is a newly created role and an exciting opportunity to shape how we develop and transition products from prototype through to volume production.

You’ll work closely with design, test, operations, suppliers, and manufacturing partners in a hands-on engineering environment, helping deliver robust, scalable, and high-quality packaging solutions for next-generation products.

Key Responsibilities:

  • Manage semiconductor assembly activities across prototype and production builds
  • Work with OSAT and manufacturing partners on package assembly and process development
  • Support new product introduction (NPI) and manufacturing readiness activities
  • Drive yield improvement and root-cause analysis for assembly-related issues
  • Coordinate reliability testing, qualification, and failure analysis activities
  • Collaborate with design, test, and product engineering teams to optimise manufacturability
  • Create and maintain assembly documentation, process flows, and manufacturing specifications
  • Identify continuous improvement opportunities across quality, cost, and production efficiency

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