Principal Advanced Packaging Engineer (R&D)
Pragmatic Semiconductor Stockton-on-Tees
Lead the technical development of FlexIC wafer-level packaging, chip-scale packaging, die attachment and system-in-package integration, setting technical direction and selecting materials, processes and partners. Drive the internal roadmap with Product Management, Engineering and Operations, validating scalable processes and transferring them to production teams. A newly created principal-level role spanning R&D, reliability qualification and external development partners.